The AI computing power module is a modular component that integrates AI chips, algorithms, and interfaces. It is designed to meet the demands of the end side/edge side for AI computing power and communication capabilities. It supports the rapid deployment of AI functions and can be widely applied in scenarios such as robots, Internet of Things devices, and industrial terminals, providing real-time data processing and decision support.
The AI computing power module is an AI computing power module product developed for various dedicated scenarios with strong demands for CPU/GPU/AI computing power. It is a subset of intelligent modules (communication + intelligent operating system + strong computing power support), developed based on SoC chips, integrating and fusing multiple computing units (CPU, GPU, ASIC, FPGA, NPU, etc.), including both general-purpose computing units and high-performance dedicated computing units. It has outstanding advantages in reducing size, lowering cost, lowering power consumption and being easy to develop. It can provide different levels of hardware computing power and match various communication methods such as 5G/Wi-Fi/ Gigabit Ethernet according to scene requirements.
AI computing power module: The core driving the development of future robots. In terms of communication and connection capabilities, the intelligent module supports communication technologies such as 5G, Wi-Fi, and Bluetooth, ensuring that the robot can flexibly access various network environments. It is also equipped with GNSS positioning technology to provide high-precision positioning services, meeting the needs of scenarios such as park delivery.
In terms of data processing and computing, the AI computing power module is equipped with high-performance processors and a rich array of peripheral interfaces, meeting the robot's demand for high computing power and supporting complex sensor fusion algorithms and high-definition video codec. Advanced edge computing technology enables robots to process data locally, significantly reducing data latency and enhancing response speed, providing users with a smoother, smarter and more efficient robot service experience.
In terms of perception and interaction, the AI computing power module integrates multiple sensors, such as cameras and lidars, to achieve comprehensive perception of the surrounding environment and enhance object recognition and obstacle avoidance capabilities. Supports voice recognition and natural language processing to achieve natural interaction with users and enhance user experience.
In terms of development and deployment, AI computing power modules offer support such as technical verification, hardware setup, and system development, reducing the cost of technical integration and accelerating product launch. At the same time, they are compatible with multiple open-source operating systems, facilitating developers to carry out customized development based on their needs. Against the backdrop of computing power gradually becoming an important productive force in the digital society and the accelerated development of the "East Data West Computing" initiative, AI computing power modules have become an important branch of intelligent modules that undergo functional iterations in response to industrial demands.
TENSORTEC TS-SG-SM7/9 series of AI computing power modules, this series of products is equipped with highly integrated computing processors such as BM1684X/BM1688/CV186AH chips. With its core advantages of super computing power, ultra-low power consumption and rich interfaces, it provides efficient and flexible computing power support for artificial intelligence scenarios Help achieve intelligent breakthroughs in terminal fields such as AI micro-servers, AI edge computing terminals, industrial control, unmanned aerial vehicles and AIoT.
In addition, this series of modules not only have lower power consumption but also adopt a wide-temperature design, with an operating temperature range of -20 ℃ to +70℃, which can adapt to various complex working environments. Meanwhile, it is Pin-to-PIN compatible with the NV Orin Nano/NX series modules, and the Pinlist/Pinmux is more abundant. Configurations of 4GB/8GB/16GB LPDDR4 are available. It supports up To 2-3B multimodal large models and also supports Tongyi Qianwen, etc. It can be widely adapted to a variety of hardware devices and software systems. Whether it is a newly developed smart product or an intelligent upgrade and transformation of existing equipment, it can be quickly integrated, significantly shortening the product research and development cycle and reducing development costs.
With outstanding performance and features, the TS-SG-SM7/9 series of AI computing power modules from TENSORTEC can flexibly handle various complex AI scenarios such as images, voice, and natural language. In intelligent voice interaction devices, it can achieve rapid and accurate voice recognition and semantic understanding, providing users with a smooth and natural interaction experience. In the field of natural language processing, it can efficiently perform tasks such as text classification and sentiment analysis, facilitating the development of applications like intelligent customer service and intelligent writing.
In the future, TENSORTEC will continue to focus on the field of AI computing power modules and fully promote the in-depth development of the AI edge computing industry. With the continuous evolution of AI technology and the sustained expansion of Internet of Things applications, the AI computing power modules of TENSORTEC will play a significant role in more fields, achieving real-time, secure and reliable AI inference applications on the edge side, and contributing to the construction of a more intelligent, convenient and efficient digital world.
